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Due to the development of NS class high peak current pulse power supply technology and detection, control and anti-interference technology, the processing efficiency of low-speed WEDM is also improving.
When cutting 300 mm thick workpiece, the processing efficiency can reach 170 mm2/min, which is a very significant technical improvement.
It can automatically detect the thickness of the workpiece and automatically adjust the processing parameters to prevent wire breakage, and achieve high processing efficiency in this state.
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Risus commodo viverra maecenas accumsan lacus vel facilisis.
Risus commodo viverra maecenas accumsan lacus vel facilisis.
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The efficiency is significantly improved due to advancements in NS class high peak current pulse power supply technology, alongside enhanced detection, control, and anti-interference systems.
For workpieces with a large thickness of 300 mm, the processing efficiency can reach up to 170 mm²/min, representing a major technical breakthrough.
The system automatically detects changes in workpiece thickness and adjusts the processing parameters dynamically to maintain high efficiency and prevent wire breakage.
It ensures that the machine operates at maximum possible efficiency under changing conditions without risking wire breakage, which saves downtime and materials.
No, because the integrated automatic detection system immediately alters processing parameters to prevent wire breakage when thickness variations are encountered.
The MCCB production line encompasses several key stages including automatic assembling, molding, metal stamping, and professional parts processing managed by a dedicated production team.
