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Due to the development of NS class high peak current pulse power supply technology and detection, control and anti-interference technology, the processing efficiency of low-speed WEDM is also improving.
When cutting 300 mm thick workpiece, the processing efficiency can reach 170 mm2/min, which is a very significant technical improvement.
It can automatically detect the thickness of the workpiece and automatically adjust the processing parameters to prevent wire breakage, and achieve high processing efficiency in this state.
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It greatly improves the cutting speed and processing efficiency of low-speed WEDM by enhancing energy density while minimizing wire loss and ensuring precision control.
Even when cutting thick workpieces up to 300 mm, the processing efficiency can achieve up to 170 mm2/min, which signifies an outstanding development in machining technology.
The system utilizes auto-detection technology to monitor thickness changes instantly and modifies the electrical and mechanical processing parameters accordingly to avoid wire breakage.
The MCCB production line integrates warehousing, moulding, metal stamping, assembling, auto-assembling, and administrative technical offices to ensure seamless quality control.
Automated assembling devices ensure repeatable accuracy, optimize processing throughput, reduce manual labor errors, and guarantee consistent structural integrity for high-voltage MCCBs.
