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The process flow follows a strict sequence: starting with copper material, followed by punching and forming, pickling, surface treatment/electroplating of copper parts, and finally welding.
Our quality control ensures that the after-sales rate of copper electroplating does not exceed 3 cases within a 7-year span, highlighting our exceptional product durability.
The process involves degreasing agent application, pickling, cleaning, silver plating (where the printing plate is converted into silver molecules by electrolysis and adsorbed onto copper by electrodes), cleaning, drying, and final drying at 100 ℃.
By passing a 7.5% potassium sulfide experiment for up to 15 minutes, we eliminate common defects like unstable welding and discoloration of copper parts, ensuring the electroplated coating does not blacken or discolor over time.
The MCCB electronic type offers advanced protection features, enhanced welding stability of internal copper parts, superior anti-discoloration electroplating, and long-term operating reliability.
ARM3e represents our high-performance electronic MCCB series, engineered with optimized manufacturing processes and stringent quality testing standards.
